Infineon and Semikron Danfoss have signed a multi-year agreement for the supply of silicon based ‘electromobility’ chips.

Infineon will provide chipsets comprising of IGBTs and diodes for power modules used for EV inverters, the primary drive component.

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“Our IGBTs and diodes play a major role in the industry’s electromobility transformation by enabling efficient power conversion in the powertrain,” said Peter Schiefer, president of Infineon’s automotive division.

“Semikron Danfoss power modules fully exploit the capabilities of IGBTs and diodes,” said Claus Petersen, president of Semikron Danfoss.

The IGBTs and diodes will be manufactured at Infineon’s factories in Dresden, Germany, and Kulim, Malaysia.

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